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Freedom Series HGR 2000, US $7,500.00 – Picture 0
Freedom Series HGR 2000, US $7,500.00 – Picture 1
Freedom Series HGR 2000, US $7,500.00 – Picture 2
Freedom Series HGR 2000, US $7,500.00 – Picture 0
Freedom Series HGR 2000, US $7,500.00 – Picture 1
Freedom Series HGR 2000, US $7,500.00 – Picture 2

Freedom Series Hgr 2000

US $7,500.00

  • San Jose, California, United States
  • Jan 30th
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The Freedom Series is A LOT MORE than simple rework stations. Actually they are the industry’s most advanced, yet easy-to-use component placement, heating and removal systems. In fact, they are best suited for BGA, CSP, Flip Chip or leaded component process development and prototype production. The Freedom 2000 uses custom Windows-based control software that incorporates features available only on the most advanced reflow soldering ovens. Control of your process, through thermal profiling and editing of heating parameters, is completely at your fingertips. Heating is precisely controlled through password protected process development, creating probably the easiest system for operators of high-end rework equipment. As a result, thermal processing of advanced components is accomplished repeatably from thin “low-mass” PCB’s to large “high-mass” PCBs up to 20” x 18” (50.8 cm x 45.7 cm). The Freedom Series standard powerful top and bottom heating system applies precise quantities of forced convective energy directly to the component and board. Any combination of gas velocity, temperature and heater height can be used to adjust the heating rate. For “high-mass” assemblies, our Honeycomb IR bottom-side pre-heater is ideal. Its large surface area and ultrahigh heat transfer coefficient provide the additional horsepower needed for rapid soldering while maintaining decreased temperature deltas, thus preventing board warp. The placement accuracy of the Freedom Series can’t be beat. With its “component-to-pad” vision/alignment system, spring-loaded work board holder and integral vacuum pickup system, the Freedom will place chip scale packages with accuracy to ± 0.001”. Also incorporated is an adjustable board support to maintain circuit board flatness during the heating cycle.

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