This auction is for 2 rolls, 20" wide. One roll is untouched at 72 yards long in it's unopened box. The roll in the opened box in the middle picture is 71 yards long. Rolls will be shipped in Styrofoam or similar container(s) packed with dry ice to maintain storage temperature. Shipment will be made via motor freight, prepaid, to any state except HI or Alaska. No international shipments. Rolls come with a Certificate of Lot Conformance showing date of manufacture December 02, 2015. Shelf life is 15 months after manufacture. Rolls have been stored below 39 deg. F since receipt. For reference, rolls cost about $3,600.00 ( includes shipping ) for 2 new. 2 is the minimum order quantity from 3M. Any questions please ask. 3M™ Thermal Bonding Film AF42 3M 62-2197-4701-1 Product Description 3M™ Thermal Bonding Film AF42 is an epoxy, thermoset film adhesive developed for structural bonding of metal, glass and other engineering grade substances for electronics applications. 3M film AF42 must be stored at or below 4°C (40°F) before use. Key Features • 177°C (350°F) cure • Tough, high peel strength • 4°C (40°F) storage required • No tack, low flow • Cures clear Physical Properties Before Cure Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes. Product 3M™ Thermal Bonding Film AF42 Base Resin Epoxy Adhesive Thickness 3 mil (0.08 mm) Liner Thickness 6.5 mil (0.17 mm) Tack None Color Translucent Construction 3 mil non-tacky adhesive6.5 mil brown paper liner 3M™ Thermal Bonding Film AF42 Physical Properties After Cure Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes. Product 3M™ Thermal Bonding Film AF42 Tensile (psi) 4800 Elongation (%) 250 Modulus (psi) 65,000 Color After Cure Clear Suggested Use Procedure Room Temperature Work Life – 3M™ Thermal Bonding Film AF42 has a work life of 4 weeks. Work life is defined as the time at room temperature that the product will still yield the performance data summarized in this data sheet if bonds are made and tested per instructions. Shelf Life – (usable life) of Bonding Film AF42 is: 4 weeks @ 21°C (70°F) 15 months @ 4°C (40°F) Cure Conditions – The suggested curing condition for 3M film AF42 is 60 minutes at 177°C (350°F). The adhesive may be cured either under pressure or in a vacuum bag. Alternate suggested cure cycles are shown below. Bondline Temperature Time (in minutes) 177°C (350°F) 60 204°C (400°F) 15 232°C (450°F) 10 During cure, pressure is required to keep parts in alignment and in intimate contact. A minimum of 20 psi is suggested, but higher psi is acceptable if resultant flow during cure is not excessive. Bondline Thickness – Unless otherwise specified, the bondline thickness used to generate the data in this data sheet was 3 mils. Since 3M film AF42 will flow when heated to its curing temperature (… and the higher the cure temperature, the more the flow…), it may be necessary to insert mechanical spacers (i.e., beads, wires, stops, etc.) in the bondline to maintain this thickness. Cold Storage Removal – Important: During storage, 3M film AF42 should be wrapped/sealed in a polyethylene (or similar) wrap/bag. When removing the wrapped roll or sheets from cold storage, especially if stored below 0°C (32°F), ample time should be given before handling or overwrap removal to allow for the roll/sheets to acclimate to room temperature for two reasons: 1) to prevent moisture from condensing on the adhesive surface; and 2) to prevent cracking of the adhesive as it is brittle when cold. Surface Preparation Prior to Bonding – A thoroughly cleaned, dry, grease-free surface is essential for maximum performance. Cleaning methods which will produce a break-free water film on metal surfaces are generally satisfactory. (2) 3M™ Thermal Bonding Film AF42 Suggested Use Procedure (continued) Application of Film to Substrate: A. Cut a portion of film sufficient for the assembly from the stock roll with protective liner(s) in place. Note earlier comment to bring adhesive to room temperature before use. B. Place the adhesive against the substrate using the liner as a protective cover. C. Position film and remove liner. D. Complete assembly and cure, be careful to avoid trapping air. Typical Overlap Shear (OLS) Adhesions to Various Substrates Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes. Substrate 3M™ Thermal Bonding Film AF42 OLS Al (etched) 4600 psi Al (sanded, solvent wiped) 3700 psi Al (scour pad abraded, solvent wiped) 3750 psi Al (solvent wiped) 500 psi CRS (scour pad abraded, solvent wiped) 1350 psi Stainless Steel (solvent wiped) 600 psi FR-4 (solvent wiped) 2500 psi LCP (solvent wiped) 400 psi Polyimide Film 650 psi Polyester Film 350 psi Black E-coat 350 psi Phenolic Board 1000 psi Ultem™ Resin 1000 1500 psi PEN Plastic 250 psi • OLS values given in psi (pounds per square inch). ASTM D1002. • Al (aluminum), CRS (cold rolled steel), FR-4 (printed circuit board substrate), LCP (liquid crystal polymer), and PEN (polyethylene naphthalate). • Solvent wiped (Methyl ethyl ketone [MEK], alcoho)*; 3M™ Scotch-Brite™ Scour Pad (green) abraded; sanded (600 grit sandpaper). • OLS bonds were 1" x 0.5" and tested at 0.2"/minute. • Bonds were cured 60 minutes (+ 7 minutes ramp time) at 121°C (250°F). • The polyimide and polyester films were overbonded to CRS using 3M™ Scotch-Weld™ Epoxy Adhesive DP-190. *Note: When using solvents, extinguish all ignition sources and follow the manufacturer’s precautions and directions for use. (3) 3M™ Thermal Bonding Film AF42 Typical Peel Adhesion to Various Substrates Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes. Substrate 3M™ Thermal Bonding Film AF42 Peel Al (etched) 55 piw Al (sanded, solvent wiped) 48 piw Al (scour pad abraded, solvent wiped) 45 piw Al (solvent wiped) 52 piw CRS (scour pad abraded, solvent wiped) 58 piw Stainless Steel (solvent wiped) 11 piw FR-4 (solvent wiped) 58 piw LCP (solvent wiped) 1 piw Polyimide Film 8 piw Polyester Film 2.5 piw Black E-coat 49 piw Phenolic Board 36 piw Ultem™ Resin 1000 50 piw PEN Plastic 14 piw Borosilicate Glass 60 piw • 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate. • Peel rate 2"/minute. • Peel values given in piw (pounds per inch width). ASTM D1876. • Al (aluminum), CRS (cold rolled steel), FR-4 (printed circuit board substrate), LCP (liquid crystal polymer), and PEN (polyethylene naphthalate). • Solvent wiped (Methyl ethyl ketone [MEK], alcoho)*; 3M™ Scotch-Brite™ Scour Pad (green) abraded; sanded (600 grit sandpaper). • Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C). • The polyimide and polyester films were overbonded to CRS using 3M™ Scotch-Weld™ Epoxy Adhesive DP-190. *Note: When using solvents, extinguish all ignition sources and follow the manufacturer’s precautions and directions for use. (4) 3M™ Thermal Bonding Film AF42 Adhesion Retention Values After Environmental Aging Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes. Aging Parameters 3M™ Thermal Bonding Film AF42 Peel* 30 days at room temperature (control) 63 piw 30 days at 71°C (160°F) oven 68 piw 30 days at 49°C (120°F)/100% RH 58 piw 30 days immersion in distilled water 55 piw Hot/cold cycling 63 piw * Peel bonds consisted of 10 mil etched aluminum strips bonded to 0.047" FR-4. Panels were cured 60 minutes + 7 minutes (ramp time) at 121°C (250°F) and peeled at 2"/minute speed. • Hot/cold cycle was 17 hours at 49°C (120°F) and 5 hours at -21°C (-5°F) with one hour at room temperature between temperature changes. Aging Parameters 3M™ Thermal Bonding Film AF42 OLS* 30 days at room temperature (control) 1200 psi 30 days at 71°C (160°F) oven 1450 psi 30 days at 49°C (120°F)/100% RH 200 psi 30 days immersion in distilled water 300 psi Hot/cold cycling 900 psi * OLS (overlap shear) bonds consisted of 3M™ Scotch-Brite™ Scour Pad (green) abraded CRS to CRS, cured 60 minutes + 7 minutes (ramp time) at 121°C (250°F) and tested at 0.2"/minute speed. • Hot/cold cycle was 17 hours at 49°C (120°F) and 5 hours at -21°C (-5°F) with one hour at room temperature between temperature changes. Solvent Resistance of Cured Films After 60 Days Immersion at RT Aging Parameters 3M™ Thermal Bonding Film AF42 Isopropyl Alcohol No Attack Methyl Ethyl Ketone No Attack Heptane No Attack 3M™ Citrus Base Cleaner No Attack • Samples were cured according to data sheet instructions [60 minutes at 121°C (250°F)] and immersed in test solvents. • After 60 days, samples were removed, dried, and examined for swelling and surface attack. (5) 3M™ Thermal Bonding Film AF42 Overlap Shear and Peel Adhesion Tested at Various Temperatures Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes. Test Temperature 3M™ Thermal Bonding Film AF42 OLS -55°C (-67°F) 1500 psi 24°C (75°F) 1300 psi 82°C (180°F) 350 psi 121°C (250°F) 175 psi Test Temperature 3M™ Thermal Bonding Film AF42 Peel -55°C (-67°F) 66 piw 24°C (75°F) 56 piw 82°C (180°F) 54 piw 121°C (250°F) 36 piw • OLS bonds were 0.5" x 1" (CRS, 3M™ Scotch-Brite™ Scour Pad [green] abraded, solvent wiped). • Peel bonds were 0.5" wide, 10 mil etched aluminum strips bonded to 0.047" FR-4 board. • Both OLS and peel bonds were made and tested in similar fashion described in previous sections. (6) 3M™ Thermal Bonding Film AF42 Electrical Properties Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes. Test Method1 3M™ Thermal Bonding Film AF42 Dielectric Constant ASTM D-150 4.6 @ 1 kilohertz 4.2 @ 10 kilohertz 3.8 @ 100 kilohertz Dissipation Factor ASTM D-150 .004 @ 1 kilohertz .006 @ 10 kilohertz .008 @ 100 kilohertz Dielectric Breakdown Strength ASTM D-149 900 volts/mil (7 mil) Volume Resistivity ASTM D-257 1.2 x 1015 ohm-cm (3 mil) 1 Tested in accordance with ASTM test method. Thermal Properties Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes. Test 3M™ Thermal Bonding Film AF42 Weight Loss 1% wt loss @ 68°C by TGA (Thermal gravametric analysis) @ 10°C/min. 5% wt loss @ 320°C 10% wt loss @ 357°C Coefficient of Thermal Expansion 63 x 10-6 (-60 to 40°C)* by TMA (units/unit/°C @ 10°C/min.) 13 x 10-6 (-60 to 40°C)** 266 x 10-6 (+65 to 125°C)** Tg (glass transition temperature) onset @ 55°C** by TMA @ 10°C/min. Tg by DSC @ 5°C/min. midpoint @ 50°C* midpoint @ 45°C** Thermal Conductivity 0.124 BTU-FT/FT2 - hr °F (Tested in accordance with ASTM C177) (0.21 Watt/M - °K) * 1st heat values ** 2nd heat values Storage Requirements The shelf life of 3M™ Thermal Bonding Film AF42 is 15 months from the date of manufacture when stored in the original packaging materials and stored at 4°C (44°F) and 50% relative humidity. Cleanup Uncured 3M™ Thermal Bonding Film AF42 can be removed using acetone, MEK or 3M™ Citrus Base Cleaner.* *Note: When using solvents, extinguish all ignition sources and follow the manufacturer’s precautions and directions for use. (7)
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